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(Heat Resistant Transparent Flexible Copper Laminates)

DKN Research Co-Develops Ultra Thin Copper-Free Flexible Circuits As Small As 0.2 Micron Thick with Micro via Holes for Scientific and Medical Devices

DKN Research Co-Develops Ultra Thin Copper-Free Flexible Circuits As Small As 0.2 Micron Thick with Micro via Holes for Scientific and Medical Devices

DKN Research Co-Develops Ultra Thin Copper-Free Flexible Circuits As Small As 0.2 Micron Thick with Micro via Holes for Scientific and Medical Devices

Flexible Circuit Substrates

* Ultra High Density Circuit (10 micron pitch, Multi-layer circuit possible)

* Double Side Circuits with Via Holes (40 micron pitch, 50 micron via hole possible)

* High Density Multi-Layer Circuit (60 micron pitch, 75 micron via hole possible)

* Flying Leads Structure

Functional Thick Film Printable & Flexible Circuits

* High Density Circuits (down to 70 micron pitch)

* Double Side Circuits with Via Holes (100 micron pitch, 80 micron via hole possible)

* Low Conductor Resistance Circuit (Soldering, Wire bonding, Flip chip bonding capable)

*Embedded Devices (Resistors, Capacitors, Inductors, Antennas, Batteries, LED, LCD) can be directly printed.

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